PulseGuard ? Suppressors
Surface Mount Polymeric ESD Suppressors
Physical Speci?cations
Environmental Speci?cations
Materials
Operating Temperature
-65°C to +125°C
Device Weight
Solderability
0.349 mg
MIL-STD-202, Method 208
Biased Humity:
Biased Heat:
40°C, 95% RH, 1000 hours
85°C, 1000 hours
MIL-STD-202, Method 107G,
Soldering
Parameters
Thermal Shock
Vibration
-65°C to 125°C, 30 min. cycle,
10 cycles
Design Consideration
Because of the fast rise-time of the ESD transient, proper
consideration to achieving optimal ESD suppression. The
devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PulseGuard
directly behind the connector so that they are the ?rst board-
level circuit component encountered by the ESD transient.
Soldering Parameters
Re?ow Condition
Pb – Free assembly
- Temperature Min (T s(min) )
150°C
Chemical Resistance
Solder Leach Resistance and
Terminal Adhesion
MIL-STD-202, Method 215
Pre Heat
- Temperature Max (T s(max) )
- Time (min to max) (t s )
200°C
60 – 180 seconds
Average ramp up rate (Liquidus Temp
(T L ) to peak
T S(max) to T L - Ramp-up Rate
Re?ow
- Temperature (T L ) (Liquidus)
- Temperature (t L )
217°C
60 – 150 seconds
Peak Temperature (T P )
260°C
Time within 5 °C of actual peak
Temperature (t p )
Ramp-down Rate
Time 2 5 °C to peak Temperature (T P )
10 – 30 seconds
Notes:
- PGB2 Series recommended for re?ow soldering only
- For recommended soldering pad layout dimensions,
please refer to Dimensions section of this data sheet
PGB2 Series
Speci?cations are subject to change without notice.
3
Revised: March 8, 2011
www.littelfuse.com
?2011 Littelfuse
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